Integration Insights

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About Integration Insights

This blog is focused on the integration of electronic systems and includes topics such as IP integration and reuse and efficient chip assembly.  As the topic deals with integration the scope of what needs integration is growing by the quarter.  Thus we have IP integration, HW/SW integration, power integration, I/O integration and chip assembly across the design and verification domains.

 

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Recent Posts

  • Addressing HW/SW Interface Quality through Standards
  • DVCON : Accellera and Standards Integration?
  • SID at DVCON2012
  • IP Integration : What is the difference between stitching and weaving?
  • Automation without abstraction is like a bicycle without pedals
  • IP-XACT Usage Survey Results
  • IP-XACT : What next? You decide!
  • IP-XACT coming back on track
  • DAC2010 : Nose wipes, no swipes, and nose swipes

Archives

  • March 8, 2012
  • March 7, 2012
  • February 29, 2012
  • February 24, 2012
  • December 15, 2010
  • November 19, 2010
  • October 1, 2010
  • September 7, 2010
  • August 27, 2010
  • June 25, 2010

More...

Recent Comments

  • David Murray on CEOs identified "integration" as the key challenge in IC design
  • Roman Wang on CEOs identified "integration" as the key challenge in IC design
  • David Murray on IP Integration : What is the difference between stitching and weaving?
  • David Courtright on IP Integration : What is the difference between stitching and weaving?
  • David Murray on Realizing the EDA360 Vision
  • David Murray on Realizing the EDA360 Vision
  • Steve Brown on Realizing the EDA360 Vision
  • Msiwinski on Realizing the EDA360 Vision
  • Mike on Acceleration and Emulation and ... ... and centralization
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